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Customer-Specific Imaging Modules in High-Resolution Image Quality

Jenoptik is a full-service provider that will develop your specific imaging concept for you — from the initial idea to the finished system.

Imaging Module
Our high-performance cameras, image processing products and complete OEM systems are ideal for use in the scientific and industrial imaging market: We supply imaging modules both for high-volume projects and for individual projects.

We tailor all of our products to your precise requirements— with a complete value chain: from sensors and sensor boards through to camera system solutions with our own firmware for your specific application.

We optimize the basic version of our compact CMOS USB camera module for your needs. With a 5-megapixel resolution and a USB 2.0 interface, this module provides the ideal platform. We can deliver customer-specific modifications within a very short turnaround time. We can also make minor changes to the hardware and software or build complete systems from different modules for your image processing applications.

For more complex projects, we can combine the properties and features of our camera module according to your requirements.

They include:
  • Form factor.
  • Resolution (1 MP, 3 MP, 5 MP, 10 MP, 14 MP, ...).
  • Sensor type (CCD / CMOS).
  • Digital interface (USB 2.0, USB 3.0).
  • Optical interface (C-mount, S-mount, CS-mount).
  • Optics, filters and more.

Expertise for Successful Imaging Modules

We deliver imaging modules that help you achieve success. Jenoptik experts are on hand to support you throughout your project, and work together with you as system partner: We take care of the design process, andperform feasibility studies, as well as devising the OEM camera design. This allows us to produce prototypes and deliver your imaging solutions in the shortest possible time.

We also support you by offering professional supply chain management, and take care of the entire value chain for you. We maintain a clear overview of the whole process, and ensure that you are able to bring your product to market quickly, helping you to secure sustainable success.

Our Expertise

  • 17 years of know-how in the production of opto-electronic systems
  • Unique selling point: Inline LED module measurement technology
  • Rapid Protoyping
  • Design for Manufacturing
  • Well-founded advice on product development, qualification and series transition
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ISO Certificates

  • DIN EN ISO 9001 (QM-System)
  • DIN EN ISO 13485 (Medical Application)
  • ISO 14001 (Environment Management System)

Department Production Information

  • Department exists since 2006 at Jenoptik
  • Area: approx. 400m²

Area consists of two clean room classes:

  • 2/3 of the area ISO class 5 (max. 832 particles with 1 µm/m³)
  • 1/3 of the surface ISO class 7 (max. 83,200 particles with 1 µm/m³)
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Process steps in detail

An Imagesensor as example

For more information please click.


High precision automated separation of different materials

  • Silicon & Germanium
  • Ceramics
  • PCB Materials
  • Composite materials and plastics
  • Glass materials

Texturation of material

  • Increase surface to realize higher bond/shear forces
  • Modify reflecting properties
  • Create flats or V-shapes for fiberoptical integration
For more information please click.


Bonding of material compositions with high accuracy and automation level

  • Silicon
  • Ceramics
  • PCB-materials
  • Composite Materials and Plastics
  • Glass Materials

Bonding with different types of adhesive technology

  • Gluing (Epoxy)
  • Soldering
  • Sintering
For more information please click.


  • Protection from mechanical & environmental impact (e.g. glass lids, filter, damm fill)
  • Performance & optimization of special optical features (e.g. placement of optical elements from glass, polymer or epoxy)
  • High accuracy & reproducibility with high automation level
For more information please click.


Performance of electrical connection

  • Gold- and Aluminum-Wire down to 12,5 µm wire diameter
  • Custom wire material compositions possible
    • Copper, platinum or silver

Learn more about our core competencies for customer imaging modules







Core competence Dicing

Mann begutachtet Halbleiter-Wafer

Semiconductor Wafer

Substrate sizes

  • Diameter up to 12 inches
  • Thickness 0.1mm to 5mm
  • Accuracy: up to 2 µm

Creation of negative 3D structures

  • Increase adhesive surface for later bonding
  • Change reflection characteristics

Full underwater separation option with following benefits

  • Increase purity
  • ESD safety through conductance controlled ultrapure water

Separable Materials

  • Ceramics and sintered ceramics
  • PCB materials / metals
  • Composite materials and plastics
  • Silicon / glass

Application Examples for Dicing

3D structure to increase adhesive surface (180µm)

Cut in sintered ceramics

Core competencies Die-Bonding

Full Format Image Sensor (Au, Ball-Wedge, 25µm)


  • Adhesive die bonding (inline dispensing & stamping)
  • Sintering
  • Stacked die bonding
  • Flip chip technology


  • Wafer-level packaging (WLP) of MEMS and sensors
  • Flip chip
  • LED modules
  • Image sensors
  • Handling of image sensor with micro lens arrys


  • Circuit boards, wafers, component carriers, lead frames

Component dimensions

  • 0.17mm up to 50mm
  • > 25µm thickness
  • Accuracy up to < 5µm

Component feed options:

  • Wafer, waffle / Gel-Pak, reel



  • Laser marking
  • Printing system (Ink Jet)


  • Traceability



  • barrel reactor


  • Clean organic residues from surface
  • Activate surface (increase adhesion forces during joining processes)

Core Competence Wire-bonding


  • Wedge-Wedge and Ball-Wedge
  • Accuracy bond tool: 2.5 µm
  • Wire diameter: 12.5 µm up to 75 µm
  • Material: gold, aluminum, silver, copper, and platinum

Core competence

  • Adjust loop profile for ultra flat bonds
  • Reflection-poor ball-wedge technology

Core competence Housing: Dispensing


  • Accuracy 14µm
  • Volume- or mass-controlled dispensing
  • Volume accuracy: 0.1µl


  • Silicone (in different cleanroom)
  • 2/3K epoxy, polyurethane

Special competences

  • Dam fill / underfill
  • Black encapsulation to reduce reflections
  • Mechanical protection
  • Optical encapsulation to change light parameter

Core competence Housing: Set and seal optics

  • Accuracy (regarding die-bonding) < 5µm
  • Processing of special epoxy resins
  • Minimization of trapped air (special evacuation procedure)
  • Cavity flushing with N2 during the setting process
  • Curing of potting with temperature or UV light

Core competence: EOL-Test

Opto-electrical measurement and AOI, contacting with card according to customer design


  • Accuracy up to 3µm
  • Current-voltage characteristics
  • 40W Current/voltage source with 4-point measurement
  • Radiant intensity and wavelength measurement
  • Automatic optical inspection (AOI)
  • Applicatio12 MP Camera
  • Switching/multiplexing with up to 32 contacts
    • Logic measurements, multi-segment displays, etc.
    • Flying probe

Further Product Recommendations

Do you have any questions? Our experts are happy to help.

Point of Contact Optical Coatings

Digital Imaging & Optoelectronic Systems

+49 3641 65-4138

+49 3641 65-3433



North America

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